ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Over-voltage Test Range
Maximum Operation Voltage
Load Dump (400 ms) at 25 °C
Reverse Polarity Voltage Range
2.0 Min at 25 °C
V BAT
V BAT
28
40
- 18
V
V
VCC Supply Voltage
Output Voltage
Positive
Negative (ground disconnected)
Digital Input Current in Clamping Mode (SI, SCLK, CS , IGN, FLASHER,
STOP, LIMP)
FETIN Input Current
V CC
V OUT
I IN
I FETIN
-0.3 to 5.5
40
-16
±1.0
+10
V
V
mA
mA
-1.0
SO and FETOUT Output Voltage
Outputs clamp energy using single pulse method (L = 2.0 mH; R = 0 ? ;
V SO
E
- 0.3 to V CC + 0.3
30
V
mJ
VBAT = 14 V at 150 °C initial)
ESD Voltage (2)
Human Body Model (HBM) OUT[1:5], VPWR, and GND
Charge Device Model (CDM)
Corner Pins (1,13,19,21)
All Other Pins (2-12, 14-18, 20, 22-24)
V ESD
± 2000
± 8000
± 750
± 500
V
THERMAL RATINGS
Operating Temperature
°C
Ambient
Junction
T A
T J
- 40 to 125
- 40 to 150
Peak Package Reflow Temperature During Reflow (3) , (4)
Storage Temperature
T PPRT
T STG
- 55 to 150
°C
°C
THERMAL RESISTANCE
Thermal Resistance, Junction to Case (5)
R ? JC
1.0
? C/W
Notes
2. ESD testing is performed in accordance with the Human Body Model (HBM) (C ZAP = 100 pF, R ZAP = 1500 ? ) and the Charge Device
Model.
3. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device .
5.
Typical value is guaranteed per design.
35XS3500
Analog Integrated Circuit Device Data ?
6
Freescale Semiconductor
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